Increasing power module efficiency with routable lead frame packaging technology

Learn more about TPSM53604

Every power supply designer is trying to maximize efficiency and eliminate
every last milliwatt that is lost as heat in DC/DC conversion. So what if I
told you that TI has a new packaging technology that not only allows you to
boost DC/DC conversion efficiency, but also do so with a smaller power supply

The TPSM53604 [1] is the first device in TI's power module portfolio to
offer you this combination, with a package that is 30% smaller than competing
BGA solutions while also providing a 300mW reduction in power loss. Watch the
video to learn more.


Improve power module thermal performance with RLF technology

  • 텍사스인스트루먼트
  • 8개월전 |  2min 56sec

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