Increasing power module efficiency with routable lead frame packaging technology

Learn more about TPSM53604
http://www.ti.com/product/TPSM53604

Every power supply designer is trying to maximize efficiency and eliminate
every last milliwatt that is lost as heat in DC/DC conversion. So what if I
told you that TI has a new packaging technology that not only allows you to
boost DC/DC conversion efficiency, but also do so with a smaller power supply
footprint?

The TPSM53604 [1] is the first device in TI's power module portfolio to
offer you this combination, with a package that is 30% smaller than competing
BGA solutions while also providing a 300mW reduction in power loss. Watch the
video to learn more.


[1] http://www.ti.com/product/TPSM53604

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